A reliable method for detecting soldering errors on circuit boards has been
developed by the heavy industries division of Mitsubishi in Japan. Three
perpendicular laser beams just five micrometres wide are fired at the solder
tracks, sending 3D data to a microprocessor. The shape of each
track—especially the adhesion angle and height—is assessed to decide
whether the solder is good or defective. Mitsubishi says the method is ten times
more reliable than existing automated systems.
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